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Power semiconductor mounting and heatsinking

On this page I’ll explain some of the most common problems in thermal management of power semiconductors, and practices which I consider good in this field.

For now, some pictures of a full bridge I recently designed with good thermal management in mind –  more to come later!


Four IGBT devices are mounted onto 4 separate heatsinks, without insulation. This design allows decoupling capacitors (red) to be mounted very close to the devices


A more clear view of how the IGBT’s were mounted. Two of them are clamped between two heatsinks by nonconductive plastic bolts. Each IGBT is facing opposite side, and a piece of rubber sheeting has been glued on top of the packages in order to even out the pressure over the package

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